Precision Bonding Device (Semi-Automatic)
Precision Bonding Device (Semi-Automatic)
This device is used for manually positioning and bonding two substrates, such as glass substrates and optical film substrates. In recent years, the demand for thinner bonded products and higher levels of appearance accuracy has increased. We have consolidated our bonding technology (speed and pressure control mechanisms) into a space-saving device, achieving high-quality bonding without scratches or bubbles.
- Company：長野オートメーション
- Price：Other
